| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem in that a conventional device having a plurality of vacuum chambers arranged linearly is increased in the size of the entire structure to make the reduction of manufacturing cost and shortening of a takt time difficult. <P>SOLUTION: There is provided a device for forming a coating film on the surface of a platy workpiece W by sputtering. The device is configured to include a plurality of vacuum chambers 1A to 1P arranged at predetermined intervals, a turntable 4 for moving the vacuum chambers, and a vacuum pump 3 for vacuuming the inside of each vacuum chamber that houses the workpiece W. Each of the vacuum chambers 1A to 1P includes a workpiece jig 4 for holding the workpiece W, a target 5 for sputtering, an inert gas introduction means 14 for introducing an inert gas, and a voltage application means 16 for applying high voltage to the target 5. This configuration can attain reduction of manufacturing cost and shortening of the takt time. <P>COPYRIGHT: (C)2012,JPO&INPIT |
