CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to increase junction area by forming a protrusion on a bump pad. CONSTITUTION: A ball land(108) is formed on the lower part of a through hole passing through an insulating base layer(110). A bump pad(116) is composed of a pillar burying the through hole and a protrusion protruded from the upper side of the insulating base layer. A conductive layer is laminated on the lower side of the insulating base layer. A releasing layer is laminated on the lower side of the conductive layer. A carrier substrate is laminated on the lower side of the releasing layer. A conductive protrusion(124,136) covers the protrusion of the bump pad. The insulating base layer includes prepreg, epoxy-based resin and RCC.