| 摘要 |
The present invention is a method of manufacture of a package-in-package system, comprising: providing a bottom internal stacking module incorporating a semiconductor die and a package substrate, attaching an internal stiffening module, with a die receptacle, on the bottom internal stacking module, and attaching a top internal stacking module incorporating a further semiconductor die and a further package substrate upside-down on the internal stiffening module. |
