| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device that is applicable to various applications, has small size and excellent heat dissipation, and allows control of the directivity of emission. <P>SOLUTION: A semiconductor light-emitting device comprises: a first metal plate that has a first primary surface; a semiconductor light-emitting element that is bonded onto the first primary surface via a connection member; a second metal plate that is disposed spaced apart from the first metal plate and is electrically connected to an electrode of the semiconductor light-emitting element via a metal wire; and a resin that integrally seals the semiconductor light-emitting element, the first metal plate, and the second metal plate. The first metal plate has reflection plates formed by bending the end portions to the first primary surface side. A second primary surface opposite to the first primary surface of the first metal plate and the surface of the second metal plate opposite to the surface onto which the metal wire is bonded are exposed on the same surface side of the resin. <P>COPYRIGHT: (C)2013,JPO&INPIT |
