| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film-shaped semiconductor chip adhesive agent which can be easily divided into a chip size by an expand process after being adhered to an adherend such as a semiconductor wafer or a semiconductor chip, or a semiconductor processing adhesive sheet including an adhesive agent layer. <P>SOLUTION: A hole 30 is formed in a film-shaped semiconductor chip adhesive agent 1. A semiconductor processing adhesive sheet is stacked on a base material using the film-shaped semiconductor chip adhesive agent 1 in which the hole 30 is formed as an adhesive agent layer, and the adhesive agent layer is stacked on the base material so as to be peeled off therefrom. <P>COPYRIGHT: (C)2013,JPO&INPIT |
