| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package which is excellent in heat resistance, heat radiation performance, and an illumination function. <P>SOLUTION: In an LED package, an insulation layer 10 is attached to an entire surface of a metal material 8. Al, Cu, Mg, or the like is preferably used as the metal material. Further, PPC treatment is performed on the surface of the metal material 8, which is made of Al or Mg, by plasma oxidation, thereby forming the insulation layer 10. An LED chip is mounted on a mounting part of the package and an entire recessed part on an upper surface is filled with a sealing resin. <P>COPYRIGHT: (C)2013,JPO&INPIT |
