| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composite multilayer substrate having a small size and reduced transmission loss at high frequency. <P>SOLUTION: A composite multilayer substrate includes an alternate stack of conductor circuit layers and dielectric layers, and the dielectric layer includes at least one ceramic layer C and at least one resin layer P. The resin layer P is formed by hardening a cross-linking resin molding containing alicyclic structure-containing polymer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
