发明名称 SUBSTRATE DELIVERY APPARATUS, SUBSTRATE DELIVERY METHOD AND SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a technology of shortening the time required for delivery, when a substrate is held horizontally on a holding member in a substrate transfer mechanism and then delivered onto a mounting table via a lifting member. <P>SOLUTION: When delivering a wafer Wa (Wb) held horizontally on a holding part of a holding member 23 onto a mounting table 3a (3b) via a lifting pin 37a (37b), positions of the wafers Wa, Wb on the holding member 23 are detected, the holding member 23 is moved based on the detection results, the timing of lifting of the lifting pin 37a (37b) is determined, and the wafer Wa (Wb) is received by pushing up the lifting pin 37a (37b) while moving the holding member 23. In order to stabilize the delivery operation of the wafer Wa (Wb) to the lifting pin 37a (37b), a deceleration section is set, and the holding member 23 is moved at high speed as usual in other sections. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012216634(A) 申请公布日期 2012.11.08
申请号 JP20110080079 申请日期 2011.03.31
申请人 TOKYO ELECTRON LTD 发明人 MIYASHITA TETSUYA;HARA MASAMICHI
分类号 H01L21/677;H01L21/68 主分类号 H01L21/677
代理机构 代理人
主权项
地址