| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device capable of splitting at an intended position with accuracy without meandering of a splitting line by utilizing an altered layer by laser irradiation and a dicing groove in splitting, and of improving an optical output of the light-emitting element with ease and certainty by utilizing a recessed part caused by the dicing groove of the obtained light-emitting element, and to provide a method of manufacturing the same. <P>SOLUTION: A light-emitting device has: a light-emitting element having a semiconductor layer laminated on a first principal surface of a sapphire substrate having the first principal surface and a second principal surface; a package to which the second principal surface of the sapphire substrate is bonded, and on which the light-emitting element is mounted; and an encapsulation member containing a phosphor, and encapsulating the light-emitting element. In the sapphire substrate, an outer edge of the second principal surface is located inside an outer edge of the first principal surface. The sapphire substrate has a recessed part formed by one curve surface of the sapphire substrate and the package. The phosphor is arranged in the recessed part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
