| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device which can further improve luminous efficiency, and a printed wiring board. <P>SOLUTION: A light-emitting device 1 has mounted on a printed wiring board 3 an LED 2 which consists of a light-emitting element 21 encapsulated with a resin sealing part 23. The printed wiring board 3 is provided with a plurality of divided solder lands 31 around the LED 2. The solder lands 31 each have a solder layer 6 formed thereon, which is coated with solidified solder. When the solder layer 6 is formed, the surface of the layer solidifies in spherical form by an action of surface tension, so that the layer surface bulged by solder becomes curved. Therefore, light emitted diagonally downwards from the LED 2 can be reflected by the bulged surface, making it possible to further improve luminous efficiency. <P>COPYRIGHT: (C)2013,JPO&INPIT |
