| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component attaching device or an electronic component attaching method capable of solving the problem of deviation in attaching an electronic component, which cannot be fully adjusted during precision adjustment before production, for improved attachment precision of the electronic component. <P>SOLUTION: In the electronic component attaching device or electronic component attaching method, a substrate is transported to a predetermined position and an electronic component is attached to the substrate that has been transported by an attachment head. The electronic component attached on the substrate is imaged, and on the basis of the imaging result, a deviation in attachment in the imaged attached electronic component from a predetermined attachment position/posture is detected. On the basis of the detection result, the attachment position/posture of the attached electronic component is corrected by referencing, as a base, a predetermined attachment position/posture of an electronic component of the same type on a different substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
