发明名称 Separated target apparatus for sputtering and sputtering method using the same
摘要 <p>PURPOSE: A split target device for sputtering and a sputtering method using the same are provided to secure uniform brightness of a substrate by evenly sputtering a deposition material on the substrate. CONSTITUTION: A split target device for sputtering(100) comprises a base plate(110) and a plurality of source units(140). The source units comprise a plurality of segment targets(120) which are attached in regular rows to one side of the base plate and a plurality of magnets(130) which are attached to the other side of the base plate in pairs with the segment targets. The source units are arranged in parallel to each other at an angle between a first direction corresponding to the row direction and a second direction perpendicular to the first direction.</p>
申请公布号 KR20120130520(A) 申请公布日期 2012.12.03
申请号 KR20110048505 申请日期 2011.05.23
申请人 发明人
分类号 C23C14/34 主分类号 C23C14/34
代理机构 代理人
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