发明名称 MANUFACTURING METHOD OF PRINT CIRCUIT BOARD MOUNTED WITH COMPONENTS
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a print circuit board mounted with components capable of reducing the thickness and simplifying the manufacturing steps thereof. <P>SOLUTION: The manufacturing method of a print circuit board mounted components which are electrically connected to each other includes the steps of: a through-hole forming step to form through-holes corresponding to the size of the components and the positions of the terminals on the print circuit board; a through-hole connecting step to form component insertion parts to connect through-holes 17 to each other by removing a part of the print circuit board between at least two through-holes formed in the through-hole forming step; and a component inserting step to insert the components so that each of the terminals of the components are brought into contact with the inner wall surface of at least two through-holes which is left after the through-hole connecting step. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012248805(A) 申请公布日期 2012.12.13
申请号 JP20110121767 申请日期 2011.05.31
申请人 ELNA CO LTD 发明人 AKAI SHINICHI
分类号 H05K3/34;H05K1/18;H05K3/32 主分类号 H05K3/34
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