发明名称 CONDUCTIVE SILVER PASTE
摘要 <P>PROBLEM TO BE SOLVED: To provide a conductive silver paste which allows a resistance value to be sufficiently lowered by a heating process for a short time, while having a certain viscosity. <P>SOLUTION: The conductive silver paste contains silver powder, epoxy resin and curing agent, in which a mixing ratio of the curing agent is 0.3-1.5 parts by weight with respect to 1 part by weight of the epoxy resin. The silver powder content is preferably 2000-4000 parts by weight with respect to 100 parts by weight of the epoxy resin. More preferably, the curing agent is at least one kind selected from the group consisting of amine-based curing agent, urea-based curing agent, acid anhydride-based curing agent and aromatic amine-based curing agent. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012248370(A) 申请公布日期 2012.12.13
申请号 JP20110118200 申请日期 2011.05.26
申请人 DAINIPPON PRINTING CO LTD;DNP FINE CHEMICALS CO LTD 发明人 NISHIKAWA MARIE;SHIODA SATOSHI;HOJO MIKIKO;SATO TAKESHI
分类号 H01B1/22;H01B13/00;H05K3/12 主分类号 H01B1/22
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