| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode package achieving excellent light efficiency. <P>SOLUTION: According to one embodiment of this invention, a light emitting diode package includes: a printed circuit board (PCB); an electrode pad formed on the PCB; a light emitting diode formed on the PCB; a first molding formed on the light emitting diode; a second molding formed on the first molding; and a guide part formed on the PCB and placed around the light emitting diode. The guide part has an inner side surface arranged perpendicular to an upper surface of the PCB. The first molding contacts with a first portion on the inner side surface of the guide part, and the second molding contacts with a second portion on the inner side surface of the guide part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
