发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition capable of forming a photosensitive layer that is satisfactorily excellent in developability of an exposed part and developer resistance of an unexposed part and can be repeatedly developed with a weakly alkaline developer, and a photosensitive film using the same. <P>SOLUTION: A positive photosensitive resin composition contains (A) a novolac type phenolic resin obtained from metacresol and p-cresol, (B) a novolac type phenolic resin obtained from orthocresol, and (C) a compound which generates an acid under light. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012252095(A) 申请公布日期 2012.12.20
申请号 JP20110123562 申请日期 2011.06.01
申请人 HITACHI CHEM CO LTD 发明人 UEDA TOMOKO;SAWABE MASARU;ITO TOYOKI;MUKAI IKUO
分类号 G03F7/023;G03F7/004 主分类号 G03F7/023
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