| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board in which distances between deep holes can be shortened, even when the deep holes are miniaturized, increase in stress exerted by surrounding portion of the wiring board is prevented, reliability is maintained, and the whole of process can be implemented at a low cost; and a manufacturing method of the same. <P>SOLUTION: The wiring board includes a plurality of through holes that penetrate the board from a major surface of the board to the rear surface opposite to the major surface. These holes are substantially filled with metal to form through electrodes. At least two or more of the through electrodes are electrically connected in parallel. In the manufacturing method of the wiring board, when forming the two or more holes, the two or more holes each having a prescribed depth are formed by a self-organizational hole-formation method including an anodic oxidation method by using a mask pattern with a size larger than an area containing the two or more holes. Then, the board is scraped from the rear surface so as to expose the holes to the rear surface to be used as through holes. <P>COPYRIGHT: (C)2013,JPO&INPIT |
