| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus which allows electronic components to be disposed immediately below a housing of a connector without forming terminals in a bent shape and improves heat radiation performance. <P>SOLUTION: An electronic apparatus includes: a substrate having electronic components disposed on one surface; a housing formed by using a synthetic resin material and disposed on the one surface of the substrate; and a connector having multiple terminals provided so as to be held by the housing and partially protrude from the housing. The connector is a vertical type connector having the terminals which protrude from a housing surface facing the substrate, perpendicularly extend, and are inserted into the substrate to be mounted. A heat radiation member formed by using a metal material is integrally provided at the housing so as to expose on the surface facing the substrate, and the terminals are inserted into the through holes formed on the heat radiation member. At least one of the electronic components is mounted on a portion on the substrate that faces the housing and electrically connects with an exposed portion of the heat radiation member. <P>COPYRIGHT: (C)2013,JPO&INPIT |
