发明名称 |
MULTI-CHIP PACKAGE WITH OFFSET DIE STACKING AND METHOD OF MAKING SAME |
摘要 |
A semiconductor device has a plurality of stacked semiconductor dice mounted on a substrate. Each die has similar dimensions. Each die has a first plurality of bonding pads arranged along a bonding edge of the die. A first group of the dice are mounted to the substrate with the bonding edge oriented in a first direction. A second group of the dice are mounted to the substrate with the bonding edge oriented in a second direction opposite the first direction. Each die is laterally offset in the second direction relative to the remaining dice by a respective lateral offset distance such that the bonding pads of each die are not disposed between the substrate and any portion of the remaining dice in a direction perpendicular to the substrate. A plurality of bonding wires connects the bonding pads to the substrate. A method of manufacturing a semiconductor device is also disclosed. |
申请公布号 |
KR20130007602(A) |
申请公布日期 |
2013.01.18 |
申请号 |
KR20127026510 |
申请日期 |
2011.03.08 |
申请人 |
MOSAID TECHNOLOGIES, INC. |
发明人 |
GILLINGHAM PETER |
分类号 |
H01L23/12;H01L23/50 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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