发明名称 MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING THEREOF
摘要 PURPOSE: A multilayer ceramic substrate and a manufacturing method thereof are provided to prevent the degradation of bonding strength between an external electrode and a ceramic laminated body through a via void. CONSTITUTION: A multilayer ceramic substrate(100) includes a ceramic laminated body(110) and an outer electrode(135). The ceramic laminated body includes a plurality of ceramic layers(112,114). First and second vias(122,124) are included in conductive material. Each ceramic layer is electrically connected by the first and second via. The first via is filled in a hole to penetrate surface ceramics. The second via is filled in a hole to be penetrate the ceramic.
申请公布号 KR20130007321(A) 申请公布日期 2013.01.18
申请号 KR20110065187 申请日期 2011.06.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHOI, YONG SEOK;LEE, DAE HYEONG;MA, WON CHUL;HONG, KI PYO
分类号 H05K3/46;H01L23/12;H05K1/03 主分类号 H05K3/46
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