| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor substrate product capable of removing a thin film of a platinum (Pt) compound without excessively oxidizing and corroding other members, and a thin film remover used for the same. <P>SOLUTION: A manufacturing method of a semiconductor substrate product includes the steps of: preparing a semiconductor substrate having a thin film of a platinum compound; preparing a thin film remover; and removing the thin film of the platinum compound by applying the thin film remover to the semiconductor substrate. The thin film remover contains a combination of halogen molecules, halogen ions, and water. <P>COPYRIGHT: (C)2013,JPO&INPIT |
