发明名称 PHOTOSENSITIVE POLYIMIDE PRECURSOR RESIN COMPOSITION FOR PATTERN FORMATION AND PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive polyimide precursor resin composition for pattern formation, the composition which uses a polyimide precursor having excellent storage stability and showing high transmittance for electromagnetic waves including those in a short wavelength region and which can be used as a photosensitive resin composition having high sensitivity. <P>SOLUTION: The photosensitive polyimide precursor resin composition for pattern formation contains a polyimide precursor having one of repeating units expressed by formulas (1a) or (1b) or both of the repeating units and an amine having no ethylenically unsaturated bond, and does not contain a photocurable component. In the formula, R<SP POS="POST">1</SP>to R<SP POS="POST">6</SP>each independently represents a hydrogen atom or a monovalent organic group. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013029841(A) 申请公布日期 2013.02.07
申请号 JP20120188731 申请日期 2012.08.29
申请人 DAINIPPON PRINTING CO LTD 发明人 SAKAYORI KATSUYA
分类号 G03F7/037;C08G73/10;G02B5/20 主分类号 G03F7/037
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