| 发明名称 |
THERMOPLASTIC RESIN COMPOSITION HAVING HIGH THERMAL CONDUCTIVITY |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition having an extremely high coefficient of thermal conductivity compared with general-purpose plastics, yet showing excellent extrusion moldability and blow moldability. <P>SOLUTION: The thermoplastic resin composition having high thermal conductivity comprises: a thermoplastic polyester resin; a polycarbonate resin if necessary; an inorganic compound having high thermal conductivity and exhibiting a coefficient of thermal conductivity of 5 W/m K or more as a single substance; and a carbodiimide compound. The carbodiimide compound is preferably a high molecular weight carbodiimide. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013028780(A) |
申请公布日期 |
2013.02.07 |
| 申请号 |
JP20110257590 |
申请日期 |
2011.11.25 |
| 申请人 |
KANEKA CORP |
发明人 |
MATSUMOTO KAZUAKI;UCHIDA SOICHI |
| 分类号 |
C08L67/00;C08K3/00;C08K5/29;C08L69/00;C08L79/00;C09K5/08 |
主分类号 |
C08L67/00 |
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