| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a SAW device capable of realizing each factor of aging characteristics, bonding strength and parallelism, respectively at a high level, and further to provide a SAW oscillator and an electronic apparatus. <P>SOLUTION: A SAW device 1 includes: a SAW chip 2 in which an IDT 22 is formed on a piezoelectric substrate 21; a base substrate 311 for supporting the SAW chip 2; and a fixing member 4 for fixing the SAW chip 2 to the base substrate 311. The SAW chip 2 is cantilever-supported on the base substrate 311 through the fixing member 4 at a position where the SAW chip 2 is not overlapped with the IDT 22, as viewed in a plan view. When a length of the SAW chip 2 in a y axis direction is defined as W and a length of the fixing member 4 in the y axis direction is defined as D, W and D satisfy a relational expression: 1<D/W≤1.6. Further, the fixing member 4 is disposed to bond an undersurface 281 and lateral surfaces 282a and 282b of a fixed end 28 of the SAW chip 2 to the base substrate 311. <P>COPYRIGHT: (C)2013,JPO&INPIT |
