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发明名称
多孔质树脂基材、及制法与多层基板
摘要
一种多孔质树脂基材及其制造方法,该多孔质树脂基材系由设置有含有电极或电路或该等双方中至少1种机能部的多孔质树脂膜所构成之多孔质树脂基材,其中该多孔质树脂膜形成有高度与该机能部的高度不同的段差部。
申请公布号
TWI387158
申请公布日期
2013.02.21
申请号
TW095121516
申请日期
2006.06.16
申请人
住友电气工业股份有限公司 日本
发明人
井户本佑一;奥田泰弘
分类号
H01R11/01;H01B5/16;H01B13/06;H01R43/00
主分类号
H01R11/01
代理机构
代理人
何金涂 台北市大安区敦化南路2段77号8楼
主权项
地址
日本
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