| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a resist pattern with sufficiently high sensitivity and resolution and ensuring sufficiently excellent peeling property of the formed resist pattern. <P>SOLUTION: The photosensitive resin composition comprises (A) a binder polymer having structural units of (1) (meth)acrylic acid, (2) a styrene derivative, and (3) a (meth)acrylic phenoxyalkyl ester derivative, (B) a photopolymerizable compound, and (C) a photopolymerization initiator. <P>COPYRIGHT: (C)2009,JPO&INPIT |
