| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus making the heat spot suppression of a housing, and the ground connection of the housing and a substrate, compatible. <P>SOLUTION: A housing has a fastening portion for fastening a substrate by a screw. The fastening portion is raised from a floor surface (a bottom surface) of the housing, and supports the substrate through a spacer. The spacer is placed on a base of the fastening portion. The spacer has predetermined height, is interposed between the fastening portion and the substrate, and is provided with a predetermined clearance between the housing and the substrate. The spacer fits a heat insulation component in a C-shaped (or a U-shaped) conductive component. The heat insulation component is equipped with a columnar substrate supporting portion having a bottom surface with a D-shaped outline, and tongue-shaped installing portions which are one-step lower than the substrate supporting portion on both sides of the substrate supporting portion. The heat insulation component has a heat insulation property, and restricts heat transmission from the substrate to the housing. The conductive component has conductivity, and ground-connects the ground of the substrate and the housing. The conductive component is formed by a thin plate so as to increase thermal resistance. <P>COPYRIGHT: (C)2013,JPO&INPIT |
