| 摘要 |
PURPOSE: A method for detecting a defect on a surface of a wafer polishing head is provided to automatically detect a minute scratch type defect generated in an inner edge portion of a polishing head accurately and rapidly when polishing a wafer with a wafer polishing device by distinguishing the minute scratch type defect with temporary materials. CONSTITUTION: A method for detecting a defect on a surface of a wafer polishing head is as follows. An inspection domain of the inner lower part of a wafer polishing head is repetitively photographed with respect to the whole circumference with a scanning camera(S904). Images of a defected portion are extracted from the images obtained in a previous step and a position of the detected portion is decided(S905). Whether or not the defected portion is periodically appeared is decided. If the defected portion is periodically appeared, the defect portions are decided as a surface defect of a wafer pad(S907). |
