发明名称 METHOD OF FORMING A METAL PATTERN
摘要 PURPOSE: A metal pattern manufacturing method is provided to increase uniformity of a metal layer by forming a metal layer along a pattern after forming the pattern by removing a peeling layer using a laser. CONSTITUTION: A peeling layer is coated on a base substrate including synthetic resin or glass(S10). The base substrate is exposed by partially removing the peeling layer and irradiating laser(S20). A metal layer is formed on the exposed base substrate(S30). The peeling layer is removed(S40). A metal pattern is formed on the metal layer through thermal curing and sintering(S50). [Reference numerals] (AA) Start; (BB) End; (S10) Step of coating a peeling layer on a base substrate; (S20) Step of exposing the base substrate by partially removing the peeling layer; (S30) Step of forming a metal layer on the exposed base substrate; (S40) Step of removing the peeling layer; (S50) Step of forming the metal layer into a metal pattern
申请公布号 KR101244747(B1) 申请公布日期 2013.03.18
申请号 KR20120098846 申请日期 2012.09.06
申请人 DYNATRON CO., LTD. 发明人 BANG, KUG HYEON
分类号 H01Q1/24;B23K26/00;H01Q13/08 主分类号 H01Q1/24
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