发明名称 HEAT SINK ASSEMBLY
摘要 <p>A heat sink assembly includes a heat pipe, a plurality of metal support members, and a mounting spring plate. The heat pipe has a first heat-receiving surface. Each metal support member has a second heat-receiving surface. The mounting spring plate has a heat pipe mounting portion for securing the heat pipe by a solder-less press-fit means, a plurality of support portions affixed to respective metal support members, and a plurality of mounting portions for securing to a base of a heat source. After the heat pipe is secured to the mounting spring plate, the first heat-receiving surface of the heat pipe would be protruded from the mounting spring plate. The second heat-receiving surfaces of the metal support members are flushed with the first heat-receiving surface of the heat pipe. Thereby, heat is transferred directly from the heat source to the heat pipe to improve heat transfer efficiency, and the weight of the heat sink can be reduced. In addition, by adopting the solder-less press-fit means, the manufacturing cost and process can be lowered and simplified respectively.</p>
申请公布号 KR200465922(Y1) 申请公布日期 2013.03.18
申请号 KR20110007128U 申请日期 2011.08.05
申请人 发明人
分类号 F28D15/02;H01L23/36;H05K7/20 主分类号 F28D15/02
代理机构 代理人
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