| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce electrical non-conduction between counter electrodes, in a wafer level packaging of an MEMS wafer. <P>SOLUTION: In the manufacturing method of an MEMS electric member, a plurality of chip regions are defined on an MEMS wafer, a movable part continuous to a fixed part is formed in each chip region, a plurality of connection electrodes having a spring electrode projecting from an anchor supported on the fixed part are formed, a cap wafer having a plurality of sets of a through conductor penetrating a wafer in the thickness direction and an extraction electrode connected with a through electrode is prepared, the extraction electrode of the cap wafer is made to abut against the spring electrode of the MEMS wafer, and then the cap wafer and the MEMS wafer are bonded. <P>COPYRIGHT: (C)2013,JPO&INPIT |
