| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder resist excellent in adhesiveness to a substrate film for a flexible print wiring board, and excellent in flexibility and solder heat resistance as the printed wiring board. <P>SOLUTION: This curable resin is obtained by reacting a polybasic acid anhydride with a hydroxy group of an epoxyacrylate obtained by (meth)acrylating an epoxy resin comprising a phenol-based resin having a phenol resin structure whose aromatic skeleton having a plurality of phenolic hydroxy groups are bonded through divalent groups represented by general formulae (1) and (2), and having a naphthylmethyl group or anthranylmethyl group on an aromatic nucleus having the phenolic hydroxy groups. In the formulae, R<SB POS="POST">1</SB>and R<SB POS="POST">2</SB>are each H, a 1-6C alkyl or a 6-18C aryl; R<SB POS="POST">3</SB>is H or methyl; and Ar is phenylene, biphenylene or naphthylene. <P>COPYRIGHT: (C)2013,JPO&INPIT |
