PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve heat radiation efficiency and signal transmission performance by applying a multilayer via and a metal post. CONSTITUTION: A base substrate(150) includes an open part for a multilayer via. A metal layer(173a,120) is formed on both sides of the base substrate. The base substrate is composed of a plurality of layers(150a,150b,150c). The multilayer via includes a metal post(140a) formed on the open part for the multilayer via and a via(1 71a) formed on the metal post. The multilayer via is a signal transmission via or a heat radiation via.