发明名称 LEAD FRAME FOR LED LIGHT-EMITTING ELEMENT, LED PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To easily manufacture a lead frame for mounting LED light-emitting element that is free of warpage by combining a plurality of kinds of material. <P>SOLUTION: When a resin-made reflector is provided together so that a substrate including an element mounting part for LED light emitting element and a lead part having an electric connection area for making electric connection with the LED light emitting element has high light reflectivity of an LED light source, layers constituting the element mounting part and lead part are made of metallic materials, and a reflector is manufactured by combining several kinds of materials while using an insulating material such as thermosetting resin. Even if the material in use differ in coefficient of linear expansion, groove parts are previously provided at parts which are mechanically cut when LED packages are cut into individual pieces, and molded together in reflector molding. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013077728(A) 申请公布日期 2013.04.25
申请号 JP20110217198 申请日期 2011.09.30
申请人 TOPPAN PRINTING CO LTD 发明人
分类号 H01L33/62;H01L23/48 主分类号 H01L33/62
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