发明名称 SOFT MAGNETIC ALLOY ASSEMBLY AND ELECTRONIC COMPONENT USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an alloy assembly of which the quality can be confirmed easily while keeping high permeability, and an electronic component using the same. <P>SOLUTION: A soft magnetic alloy assembly comprised of a particle molding 1 is provided. The particle molding 1 includes a plurality of metal particles 11 comprised of Fe-Cr-Si based soft magnetic alloys, an oxide film 12 formed on surfaces of the metal particles 11, and a coupling parts 22 via the oxide film 12 formed on neighboring metal particle surfaces. Regarding the particle molding 1, in colorimetry/color-difference measurement represented with a L*a*b colorimetric system, a*(D65) is -3 to 5, b*(D65) is -8 to 0 and effectively, L*(D65) is 22 to 35. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013077618(A) 申请公布日期 2013.04.25
申请号 JP20110215185 申请日期 2011.09.29
申请人 TAIYO YUDEN CO LTD 发明人
分类号 H01F1/24;B22F1/02;C22C38/00;H01F1/33;H01F27/255 主分类号 H01F1/24
代理机构 代理人
主权项
地址