发明名称 PLASMA PROCESSING APPARATUS
摘要 There is provided a plasma processing apparatus that can generate uniform plasma without increasing costs per unit electric power even though the discharge area is increased to adapt to samples in given sizes by arranging a plurality of plasma discharge units. A plasma processing apparatus includes an RF power supply having an RF signal circuit and an RF power circuit, a case, and a discharge electrode. A plasma module is configured of the discharge electrode and the RF power circuit provided in the case. A frequency signal from the RF signal circuit is inputted to a plurality of the plasma modules connected in parallel with each other.
申请公布号 US2013098556(A1) 申请公布日期 2013.04.25
申请号 US201213654572 申请日期 2012.10.18
申请人 HITACHI, LTD.;HITACHI, LTD. 发明人 KOBAYASHI HIROYUKI;NAGAISHI HIDEYUKI;TANDOU TAKUMI;ITABASHI NAOSHI
分类号 C23C16/509;B08B13/00 主分类号 C23C16/509
代理机构 代理人
主权项
地址