| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition, prepreg, laminate sheet and wiring board, capable of achieving low thermal expansion at a low cost. <P>SOLUTION: The resin composition, used for manufacture of a laminate sheet, includes insulating resin having an aromatic ring. The molecular mass between crosslinking points of insulating resin, obtained from a shear modulus equal to or higher than Tg of the insulating resin having the aromatic ring, is 300-1,000 in a stage after manufacture of laminate sheet. <P>COPYRIGHT: (C)2013,JPO&INPIT |
