WIRE SAW APPARATUS, METHOD FOR CUTTING WORKPIECE AND METHOD FOR MANUFACTURING WAFER

摘要

PROBLEM TO BE SOLVED: To suppress or prevent a scratch in a wafer which is generated during the acceleration or deceleration of a wire accompanied by wire reciprocating traveling and the switching of wire reciprocation.

SOLUTION: A workpiece feeding mechanism 18 reverses a workpiece feeding direction at the beginning of the deceleration of the wire, and the workpiece feeding mechanism 18 separates the wire 4 from a workpiece cutting position (cut bottom surface) when the wire is stopped. A distance equal to or longer than the size of an abrasive grain is preferably spaced apart between them. The wire 4 is then accelerated in an opposite direction for reciprocating traveling, and also a workpiece feeding direction is reversed again in a cutting direction at the beginning of the acceleration of the wire to resume machining at the timing of reaching a maximum speed of the wire.

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