| 摘要 |
In an example, a method includes aligning a pin of a surface mount module with a corresponding first pin of a header pin assembly of a socket assembly of a circuit board. The first pin includes a first portion configured to electrically couple to the circuit board. A second portion includes a retention feature configured to selectively retain the second portion in engagement with the pin of the surface mount module. The surface mount module is moved in a first direction toward the circuit board, wherein the pin of the surface mount module pushes against the second portion to move the second portion to a second position to allow the pin of the surface mount module to pass by the retention feature. The second portion is configured to move back toward a first position once the pin is moved past the retention feature to engage the pin.
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