发明名称 |
METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON SUBSTRATES |
摘要 |
Described is a method of forming a metal or metal alloy layer onto a substrate comprising the following steps i) provide a substrate including a permanent resin layer on top of at least one contact area and a temporary resin layer on top of the permanent resin layer, ii) contact the entire substrate area including the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface and i) electroplate a metal or metal alloy layer onto the conductive layer.
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申请公布号 |
US2013105329(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
US201113808655 |
申请日期 |
2011.07.29 |
申请人 |
MATEJAT KAI-JENS;LAMPRECHT SVEN;EWERT INGO;SCHOENENBERGER CATHERINE;KRESS JUERGEN;ATOTECH DEUTSCHLAND GMBH |
发明人 |
MATEJAT KAI-JENS;LAMPRECHT SVEN;EWERT INGO;SCHOENENBERGER CATHERINE;KRESS JUERGEN |
分类号 |
H05K3/40 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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