| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device where a metal layer, forming a die attach pad and a wiring part, does not easily deteriorate. <P>SOLUTION: An electronic device according to this invention includes: a ceramic substrate 2 and an electronic element 1. A metal layer 8 is formed on a surface 21 of the substrate 2 and the electronic element 1 is installed on a surface of the metal layer 8 thereby thermally and electrically connecting the electronic element 1 with the metal layer 8. The metal layer 8 is formed in a region R2, located at the inner side relative to an outer peripheral edge of a region R1 covered by the electronic element 1, from among the surface 21 of the substrate 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
