PURPOSE: A light source module is provided to improve heat dissipation by filling a thermal conduction material between a circuit board and a ceramic substrate. CONSTITUTION: A groove(112) is formed in a circuit board(110). A ceramic substrate(120) is inserted into the groove. At least one light emitting device is arranged on the ceramic substrate. A thermal conduction material(130) is filled in the inner part of the groove. The thermal conduction material is filled between the outer parts of the ceramic substrate.
申请公布号
KR20130053781(A)
申请公布日期
2013.05.24
申请号
KR20110119416
申请日期
2011.11.16
申请人
LG INNOTEK CO., LTD.;KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION