| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface wave plasma processing apparatus that can increase uniformity of plasma density. <P>SOLUTION: A surface wave plasma processing apparatus comprises a slot antenna 21 at a position where the apparatus and the dielectric window 16 of a wave guide 20 face each other, and also comprises a shield member 30 including a shield part 32 and a transmission part 33 between a base 12 and the dielectric window 16. Viewed from the normal direction of the placement surface of the shield member 30, the area of an antenna part 24 of the slot antenna 21 is regarded as S1, the area where the antenna part 24 and the shield part 32 overlap as S2, the area of an opening part 23 of the slot antenna 21 as S3, and the area where the opening part 23 and the shield part 32 overlap as S4, and then the shield member 30 is formed such that the condition S2/S1<S4/S3 is satisfied. <P>COPYRIGHT: (C)2013,JPO&INPIT |
