发明名称 TILE JOINT STRUCTURE AND ADHESIVE COMPOSITION FOR MOISTURE-CURABLE TILES
摘要 <P>PROBLEM TO BE SOLVED: To provide a tile joint structure for not generating discoloration of a joint filler due to an adhesive, its construction method, and an adhesive composition for moisture-curable tiles. <P>SOLUTION: The tile joint structure includes: an adhesive layer 16 formed on a surface of a substrate material 18; a plurality of tiles 12 bonded on an upper surface of the adhesive layer; and an inorganic joint filler 14 filled in a joint gap 15 of the plurality of tiles. An adhesive forming the adhesive layer contains: (A) a moisture-curable organic polymer; (B) a 6-hydroxychroman derivative indicated by the general formula (1); and (C) at least one kind of non-chelate tin compound selected from dialkyl tin alkoxides and a reaction product of dialkyl tin oxides and a silicate compound. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013108306(A) 申请公布日期 2013.06.06
申请号 JP20110255230 申请日期 2011.11.22
申请人 CEMEDINE CO LTD 发明人 NISHIMURA KANA;ABE HIDEYUKI;HASHIMUKAI HIDEJI
分类号 E04F13/21;E04F13/08 主分类号 E04F13/21
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