| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board for the peripheral circuit of a highly reliable large capacity module capable of transmitting the heat generated from a high heating element such as a power semiconductor element efficiently to the outside, while achieving reduction in size and weight, low surge and low loss, in a large capacity module including a power module such as an inverter, and to provide a large capacity module including a peripheral circuit using that circuit board, and a manufacturing method of the large capacity module. <P>SOLUTION: Low surge is achieved by embedding a capacitor 126 in a peripheral circuit board 121 while achieving reduction in size and weight and low loss of a module 100 by laminating the peripheral circuit board 121 on a power semiconductor element 113 arranged on a power circuit board 111. Further, a heat conduction path via a peripheral circuit board 121 is ensured by such a configuration as not to arrange a capacitor in a region corresponding to a surface of the peripheral circuit board 121 facing the power semiconductor element 113. <P>COPYRIGHT: (C)2013,JPO&INPIT |
