| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a capacitor module built-in wiring board which achieves low manufacturing costs and excellent connection reliability. <P>SOLUTION: In a capacitor module built-in wiring board 10, multiple terminal pads 44 for surface-mounting a semiconductor chip 21 are provided on a substrate main surface 51 and pads for a BGA 48 are provided an a substrate rear surface 52. A capacitor module 101 is composed of a glass substrate 102 and multiple chip capacitors 103 mounted on a second surface 106 of the glass substrate 102. The capacitor module 101 is incorporated immediately below a semiconductor chip mounting region 23 set on the substrate main surface 51 with the first surface 105 side where the chip capacitors 103 are not mounted facing the substrate main surface 51 side. <P>COPYRIGHT: (C)2013,JPO&INPIT |
