| 摘要 |
A cooling system for cooling an electronic device includes a heat exchanger, a first refrigerant pipe, a pump, a second refrigerant pipe, and a cooling apparatus. The heat exchanger, the first refrigerant pipe, the pump, and the second refrigerant pipe are connected in that order to form a first circulation system. The cooling apparatus is connected between the pump and the second refrigerant pipe. The cooling apparatus is exposed outside the electronic device. When the temperature outside the electronic device is higher than the temperature in the electronic device, the first circulation system cools the electronic device. When the temperature outside the electronic device is lower than the temperature in the electronic device, the refrigerant flows through the cooling apparatus to be cooled.
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