| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method which can simultaneously perform bonding processing at plurality parts without depending on limitation in a supply time of a bonding material, and provide a semiconductor device manufacturing method using the bonding method.SOLUTION: A bonding method comprises temporarily assembling a chip 1 and a lead frame 5 with sandwiching a solid solder block 4. The solder block 4 has a protrusion 11 protruding in a single direction. The chip 1 and the lead frame 5 are temporarily assembled by insertion of the protrusion 11 into a solder supply hole 21 of the lead frame 5. The bonding method further comprises loading the temporary assembling in a reflow furnace to melt the solder block 4; and subsequently solidifying the solder block 4 to bond the chip 1 and the lead frame 5. |
