| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing device and a control method of the laser processing device, in particular, the laser processing device, which selectively performs laser processing only to a portion of a substrate where the laser processing is required, simplifies the substrate positioning work for the laser processing, and positions the substrate in a subsequent process without using a separate measurement part to perform the processing, and the control method of the laser processing device.SOLUTION: A laser processing device includes: a reaction chamber where a substrate is housed; a marking part included in the reaction chamber and forming a reference point in the substrate; a sensing part sensing a position of the substrate or a position of the reference point; a driving part moving a stage where the substrate is placed; and a control part responding to a position signal transmitted from the sensing part and transmitting an operation signal to the marking part or the driving part. |
