PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE LAMINATE, FLEXIBLE CIRCUIT BOARD AND METHOD FOR FORMING PERMANENT PATTERN

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition suitable for forming a solder resist excellent in both of folding resistance and flame retardancy.SOLUTION: The photosensitive resin composition comprises an acid-modified ethylenically unsaturated group-containing polyurethane resin, an inorganic frame retardant, a radical polymerizable compound, and a photopolymerization initiator. The acid-modified ethylenically unsaturated group-containing polyurethane resin has a partial structure expressed by general formula (U1). In general formula (U1), Lrepresents a divalent connecting group including neither an ethylenically unsaturated group nor a carboxyl group.